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TDK expands inline structure and low-resistance type MEGACAP MLCCs with metal frames for automotive

  • Admin
  • 2024年11月2日
  • 讀畢需時 3 分鐘

  • The automotive-grade inline structure MEGACAP MLCCs are qualified based on the automotive standard AEC-Q200

  • Low resistance achieved by optimizing metal frame materials

  • Lineup includes 99 nF/1000 V with Class 1 and 47 μF/100 V with Class 2 dielectric


CAA573 CAA572

The actual appearance of the product differs from the image.

TDK logo is not stamped on the actual product.


TDK Corporation (TSE:6762) has extended the automotive-grade CA series of its MEGACAP MLCCs with a metal frame. Mass production of the product series began in September 2024.

In recent years, the development of automobiles with electric powertrains, such as hybrid- (HEVs) and battery-electric vehicles (BEVs), and highly efficient charging technologies, has significantly progressed. Both help to reduce greenhouse gas emissions. In these applications, the power consumption of various subsystems including inverters, onboard chargers (OBCs), and wireless power transfer (WPT) systems is increasing, and MLCCs must handle high currents and have large capacitance.

To meet these needs, TDK developed the CA series, the largest MLCCs in the industry* (6.00 x 5.60 x 6.40 mm) with a metal frame and 3-line type structure. TDK now provides an extensive lineup including 99 nF/1000 V with a Class 1 dielectric and 47 μF/100 V with a Class 2 dielectric.

To handle high currents, TDK has reduced the equivalent series resistance (ESR) compared to the previous products by optimizing the materials of the metal frame. This helps reduce the number of components and miniaturizes devices. TDK will further expand its lineup to meet the needs of customers.

* As of September 2024, according to TDK

Main applications

  • Smoothing and decoupling of the power lines

  • Resonant circuits in subsystems such as OBCs and WPTs

  • Snubber circuits in inverters

Main features and benefits

  • Low resistance achieved by optimizing metal frame materials

  • High capacitance achieved using multiple MLCCs to help reduce the number of components and miniaturizing devices

  • High reliability qualified based on AEC-Q200


Type

Outer dimensions


[mm] (L x W x H)

Type

Temperature characteristics

Rated voltage


[V]

Capacitance


[F]

6.00 x 5.60 x 6.40

2 - line

C0G

1000

20 n

6.00 x 5.60 x 6.40

2 - line

C0G

1000

30 n

6.00 x 5.60 x 6.40

2 - line

C0G

1000

44 n

6.00 x 5.60 x 6.40

2 - line

C0G

1000

66 n

6.00 x 8.40 x 6.40

3 - line

C0G

1000

99 n

6.00 x 5.60 x 6.40

2 - line

C0G

630

200 n

6.00 x 8.40 x 6.40

3 - line

C0G

630

300 n

6.00 x 5.60 x 6.40

2 - line

X7T

630

1 µ

6.00 x 7.50 x 6.40

3 - line

X7T

630

1.5 µ

6.00 x 5.00 x 6.40

2 - line

X6T

450

2.2 µ

6.00 x 7.50 x 6.40

3 - line

X6T

450

3.3 µ

6.00 x 5.00 x 6.40

2 - line

X7T

350

2.2 µ

6.00 x 7.50 x 6.40

3 - line

X7T

350

3.3 µ

6.00 x 5.00 x 6.40

2 - line

X7S

100

33 µ

6.00 x 7.50 x 6.40

3 - line

X7S

100

47 µ

6.25 x 5.00 x 6.70

2 - line

X7R

35

100 µ

6.25 x 7.50 x 6.70

3 - line

X7R

35

150 µ

6.25 x 5.00 x 6.70

2 - line

X7R

25

100 µ

6.25 x 7.50 x 6.70

3 - line

X7R

25

150 µ

Samples may be purchased from the product page that is displayed after clicking Type.


Source from TDK



 
 
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